Improvement of temperature-sensitive head card die structure
October 16, 2018
Figure 1 shows a temperature-sensitive head card punching piece, which is unfolded as shown in Figure 2, with a material of 2A02 and a thickness of 0.5 mm. The part has a compact structure and needs to be formed by three-sided bending. The part requires a smooth and smooth surface without warpage, wrinkles, cracks and the like, and the mold should be designed to be continuously punched and bent. If the feeding direction is selected improperly in the design, it is easy to cause irregularities in the shape of the punched out parts, large burrs, and poor size.